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Contact (User Office)

 

Karlsruhe Nano Micro Facility

H.-von-Helmholtz-Platz 1

76344 Eggenstein-Leopoldshafen, Germany

 

phone: +49(721)608-23123

fax: +49(721)608-26273

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KNMF Profile User Office

Featured Technology: Dry Etching RIE(ICP) / RIBE

 

The Oxford Plasmalab System 100 with ICP 380 source is an advanced RIE/ICP tool for dry etching techniques, especially silicon etching. The basic feature is a high frequency generator working at 13,56 Mhz, combined with a high vacuum chamber for wafers with a diameter of 4”.

KNMF Dry Etching
Dry Etching RIE(ICP) / RIBE

The power range varies from 1…300 W for the RIE respectively 100 … 2500 W for the ICP source, the typical process pressure is 2.5…20 mTorr. Available process gases are SF6 and O2 for silicon etching, a combination of Cl2, He and O2 for chromium.

Dry etched Si cantilevers
SEM image of silicon cantilevers

Source: IMT

For more information see
Dry Etching datasheet (PDF)

Benefit from unique technologies and leading expertise

Explore our competences for advanced multimaterial micro and nanotechnologies.

The Karlsruhe Nano Micro Facility (KNMF) offers a dedicated set of state-of-the-art technologies for structuring and characterising a multitude of functional materials at the micro- and nanoscale.

KNMF unifies more than 24 technology clusters and 39 scientists.With an additional technology investment budget of 23.3 Mio. Euro, allocated by the Helmholtz Association of German Research Centers (HGF), regular updates and major investments are subject to a continuous improvement of both, the value of the facility and the welfare of its users. Our technology experts support all users in all questions relating to the access and use of our technologies. They will serve as local contacts and accompany you to reach your personal goals. This may include conducting processes at the laboratories or organising overall workflows for your own project. It is recommended to select and contact the experts of the technologies of interest prior to a proposal submission. The user office will assist you to find the most appropriate experts.

We invite you to read more about our technologies and expertise by downloading the datasheets of interest. Technologies labelled in grey are subject to major investments and are available soon.

KNMF Laboratory for Micro- and Nanostructuring

» Electron beam lithography

» Deep X-ray lithography

» Direct Laser Writing - NEW

» Laser material processing

» Injection moulding

» Hot embossing

» Focused ion beam

» Dip-pen nanolithography

» Thin film technologies

» Dry etching cluster

KNMF Laboratory for Microscopy and Spectroscopy

» Atomic force microscopy

» Auger electron spectroscopy

» Bulk and trace analysis of nanomaterials

» Electron probe micro analysis - available in Calls 1-9 only

» Laser ablation ICPMS

» Scanning electron microscopy - since Call 10 integrated in other technologies

» Single Crystal X-ray Diffraction - NEW

» Thin film characterisation methods
» Transmission electron microscopy

» X-ray photoelectron spectroscopy

KNMF Laboratory for Synchrotron Characterisation

» Infrared/THz Spectroscopy and Ellipsometry

» Polycrystalline/Powder Diffraction

» Soft X-ray spectroscopy, microscopy, and spectromicroscopy - NEW

» X-Ray Absorption Spectroscopy

» Hard X-ray microscopy and 3D tomographic imaging

» High resolution synchrotron small angle X-ray scattering

» Laboratory diffractometry under non-ambient conditions