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Contact (User Office)

 

Karlsruhe Nano Micro Facility
KIT-Campus North

Building 440

H.-von-Helmholtz-Platz 1

76344 Eggenstein-Leopoldshafen, Germany

 

phone: +49(721)608-23123

fax: +49(721)608-26273

knmf-userofficeMoe2∂kit edu

User Office

KNMF Profile

Laser Material Processing (LMP)

KNMF Laboratory for Micro- and Nanostructuring

An appropriate choice of laser and process parameters is used to control the interaction between laser radiation and material on micrometer and nanometer scale. The types of materials processing which can be carried out are micro- and nanostructuring, microdrilling, cutting, laser transmission welding and surface modification, respectively. The actual smallest structure size which can be achieved, each according to the process and material, is in the range of 200 nm to 400 nm. Aspect ratios up to a maximum of 50 can be realized. Ultraviolet laser radiation as well as ultrafast lasers (femtosecond and picosecond pulse duration) have a particularly high potential for precise micro- and nanoablation, due to its selective material removal and very low thermal load.

Download technology description (PDF)

Contact

Dr. Wilhelm Pfleging

Phone +49 721 608-22889
Fax +49 721 6089-22889
Email wilhelm pflegingWzu8∂kit edu
Institute for Applied Materials (IAM-AWP) - www.iam.kit.edu/awp/english

Processes/limitations

  • Structuring of polymer materials and thin films with excimer lasers or high repetition rate and ultrafast laser radiation: structure size 200 nm
  • Aspect Ratio: 50 for drilling, 10 for ablation and cutting
  • Structuring of metals and ceramics: resolution 1 µm - 10 µm
  • Deposition and structuring of tape cast battery materials: 5-50 µm
  • Cutting of metals, ceramics, polymers, and battery materials: cutting width 5 µm - 50 µm
  • Laser LIGA: surface roughness Ra =60 nm, edge radius 1 µm, aspect ratio 5
  • Surface modification of polymers and thin films / adjustment of wettability / surface energy / biocompatibility with structure width <1 µm
  • Laser-assisted moulding of polymers for the rapid generation of micrometer and nanometer-sized surface structures

Materials

  • Structuring:
    PMMA, PS, PEEK, PI, PSU, thin films (amorphous carbon, SnO2, LiCoO2 ,...), standard battery materials (LiCoO2, LiMn2O4, NMC, LiFePO4), steel, nickel, brass, WC, Al2O3, ZrO2, SiC
  • Cutting:
    Steel, Ti, NiTi, quartz, Al2O3, PMMA, PI, PS
  • Laser-LIGA: nickel
  • Surface modification:
    PS, PC, PMMA, amorphous carbon thin films

Typical structures and designs

Fig. 1

Fig. 1: Micro-machining workstation (PS450-TO, Optec) equipped with a tunable ultrafast laser (Tangerine, Amplitude SYSTEMES) and a tunable short pulse fiber laser (IPG photonics)

 

Fig. 2:

Fig. 2: Laser structured mould insert made of steel for replication of microfluidic chips (channel structure width 50 μm)

 

Fig. 3

Fig. 3: Laser microstructured SnO2 anode material

 

Fig. 4

Fig. 4: Laser generated microgrooves in polystyrene

 

Fig. 5

Fig. 5: Local control of wetting behaviour due to laser-assisted surface modification of PDMS

 

Fig. 6

Fig. 6: SEM image of conical microstructures in NMC cathode material formed by excimer laser radiation

Fig. 7

Fig. 7: Specific discharge capacities of an unstructured and laser structured cathode material for lithium-ion batteries (Swagelok® design)