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Karlsruhe Nano Micro Facility
KIT-Campus North

Building 440

H.-von-Helmholtz-Platz 1

76344 Eggenstein-Leopoldshafen, Germany

 

phone: +49(721)608-23123

fax: +49(721)608-26273

knmf-userofficeIuq9∂kit edu

User Office

KNMF Profile

Thin Film Technologies (TFT)

KNMF Laboratory for Micro- and Nanostructuring

Technologies

Download technology description (PDF)

Contact

Dr. Harald Leiste

Phone +49 721 22541-22889
Fax +49 721 608-22567
Email harald leisteZzr7∂kit edu
Institute for Applied Materials (IAM-AWP) - www.iam.kit.edu/awp/english

 

PVD 2D Coating

By reactive and non-reactive magnetron sputtering 2-dimensional samples can be coated with metallic or ceramic films in a thickness of 10 nm to 5 μm in order to improve surface properties of the substrates or to allow complete new properties of the system. The deposition process runs in a noble or reactive gas atmosphere at a pressure of Pa in a dc or r.f. plasma process. Thin films can be realized for protective and functional applications. Multilayer or sandwich coatings with up to four different materials can be realized without breaking vacuum.

Features

  • Single and multilayer modus
  • Reactive gas components N2, CH4, O2
  • Different coating concepts like nanocomposites, multilayer and graded coatings are possible
  • Typical targets: metals, ceramics, glasses
  • Protective (wear resistant) and functional (ferromagnetic) coatings

Limitations/constraints

  • Max. sample height 20 mm
  • Max. four targets
  • Target size Ø 75 mm and Ø 150 mm
  • No conductive limitations of material
  • Directed coating; no coating inside of tubes or holes
  • Surface topography and roughness will be reproduced

Materials

  • Metals
  • Ceramic
  • Glass

Typical structures and designs

Figure 1

Fig. 1: PVD Thin film deposition facility Leybold Z550

 

Figure 2

Fig. 2: Fracture surface of a TiN/ZrN multilayer coating

 

PVD 3D Coating

By reactive and non-reactive magnetron sputtering two- or three-dimensional samples can be coated at temperatures between 200 °C and 400 °C with metallic or ceramic films in a thickness of 100 nm to 5 μm in order to improve surface properties of the substrates or to allow complete new properties of the system. The deposition process with balanced and non-balanced magnetron regime runs in a noble or reactive gas atmosphere in a pressure range of Pa in a plasma dc process. Plasma cleaning process before coating is mandatory. Rotating of samples is commonly used.

Features

  • Three fold rotation
  • Stop and go modus (two fold rotation in front of one target)
  • Reactive gas components N2, CH4, O2
  • Multilayer and graded coatings possible
  • Typical targets: metals electrical, conductive ceramics

Limitations/constraints

  • Max. sample height 350 mm
  • Temperature range 200–400 °C
  • Electrical conductive substrate
  • Max. two conductive targets
  • Directed coating; no inside coating of tubes or holes

Materials

  • Metal
  • Ceramic

Typical structures and designs

Figure 3

Fig. 3: PVD Thin film deposition facility Hauzer HTC625

 

Figure 4

Fig. 4: Coated tools and components

 

CVD/PVD Hybrid Coating

By r.f. or dc reactive and non-reactive magnetron sputtering as well as microwave plasma source deposition two-dimensional samples can be coated at temperatures between 100 °C and 900 °C with metallic or ceramic films in a thickness of 100 nm to 5 μm to improve surface properties of the substrates or to allow complete new properties of the system. The deposition processes are running in gas atmosphere consisting of Ar, N2, O2, CH4 and/or C2H2 in a pressure range of 0.1 Pa and 10 Pa.Plasma cleaning process before coating is mandatory. The samples are fixed on the substrate holder. A dc or r.f. substrate bias can be applied.

Features

  • Using of max. 3 magnetrons and 2 microwave plasma sources simultaneously
  • Reactive gas components N2, C2H2, CH4, O2
  • Multilayer and graded coatings and nanocomposites possible
  • Typical targets: metals electrical, conductive ceramics
  • No substrate rotation

Limitations/constraints

  • Max. sample height 10 mm, max. sample diameter 75 mm
  • Temperature range 100–900 °C
  • Electrical conductive or non-conductive substrates
  • Max. 3 conductive or non-conductive targets
  • Directed coating; no inside coating of tubes or holes

Materials

  • Metal
  • Ceramic

Typical structures and designs

Figure 5

Fig. 5: CVD/PVD-hybrid coating apparatus

 

Figure 6

Fig. 6: 3D-CAD sketch of a patented high performance plasma source